1G High Performance Liquid Metal Thermal Paste / for Heatsinks CPU GPU

• liquid metal thermal paste cpu delidding tool
• computer thermal paste thermal pad spreader
• thermal paste remover gpu gpu

Description:

is a high performance liquid metal thermal compound, designed for applications that require very high efficiency.
Liquid metal thermal compound is based on a eutectic alloy. A special combination of metals like tin, gallium and indium results in very high thermal conductivity and excellent long-term stability.
Recommended for experienced users who are looking for a top performance product with best heat dissipation where temperature ranges are above 10 degreeC.
high thermal conductivity, increased indium content, Easy application with synthetic
Recommended for applications that require extremely high thermal conductivity temperature - e.g. between a silicon chip PC microprocessor and heat sink.

Specification:

Size: 120mm x 60mm x30mm/4.7 x 2.4 x 1.2 inch
Specific gravity: 6.24g/cm3
Working temperature: 10 degreeC-140 degreeC
Thermal conductivity: /
Shape: liquid
Color:
Applications: CPU, GPU,Notebook computer, IC

Package Includes:

1x Liquid Metal Thermal Compound.

Note:

It should boxed and under conditions temperature.